By such action, the Telecommunications Industry Association or the Alliance for Telecommunications Industry Solutions or its sponsored Committee T1 does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. From Project No. A Word from ATIS Committee T1 Established in February , Committee T1 develops technical standards, reports and requirements regarding interoperability of telecommunications networks at interfaces with end-user systems, carriers, information and enhanced-service providers, and customer premises equipment CPE.
|Published (Last):||5 August 2019|
|PDF File Size:||17.39 Mb|
|ePub File Size:||3.6 Mb|
|Price:||Free* [*Free Regsitration Required]|
In an effort to provide updated information and more detail, the TR TIA reviews most standards every five years. At that time standards are reaffirmed, rescinded, or revised according to the submitted updates. It added greater grounding bus bar detail, tower and antenna grounding and bonding recommendations, work area and personal operator-type equipment position bonding and grounding recommendations and revised harmonized terminology. We are currently soliciting additional recommendations for topics to be included in the update.
What is the current status of B, and when do we expect to see the new standard approved? The following scope has been approved for TIAB: This Standard specifies the requirements for a telecommunications bonding and grounding infrastructure, and its interconnection to other systems, where telecommunications equipment will be installed.
This Standard may also be used as a guide for the renovation or retrofit of existing systems. As we are in the beginning development phases, it is too early to tell when this will be approved. We would like to see greater participation from equipment manufacturers and end users. A number of specialized high bandwidth telecommunications applications have emerged requiring high performance bonding and grounding systems.
Some of those applications under consideration are:. There has long been confusion surrounding bonding of shielded cabling systems.
Is this an area that will be better explained and incorporated into B? Yes, the working group is planning to clear up much of the confusion surrounding bonding of the new shielded and screened cabling systems. In the interim, contact cabling and connectivity manufacturers for their recommendations.
Additionally, there is a groundswell from the industry asking for guidance and clarification for high performance copper cabling systems. Issues such as wire gauge sizing, use of building steel, performance vs. In order to provide complete functionality, this web site needs your explicit consent to store browser cookies. If you don't allow cookies, you may not be able to use certain features of the web site including but not limited to: log in, buy products, see personalized content, switch between site cultures.
It is recommended that you allow all cookies. I hereby accept that the provided information can be used for marketing purposes and targeted website content.
In this section. CPI Blog. Search CPI in the News.
Grounding and Bonding Standard 607-A Is Currently Being Updated